Description
Features
- High tensile strength with excellent insulation performance
- Soft and flexible, easy to wrap and apply on various surfaces
- Superior dielectric strength and voltage resistance
- Strong adhesion with no lifting, falling off, or adhesive residue
- Excellent heat and chemical resistance, suitable for harsh conditions
Applications
- Surface masking and protection in high-temperature environments
- Widely used for electroplating, electrophoresis, and ultra-high temperature painting
- Ideal for powder coating processes and high-temperature baking
- Applied in semiconductor and electronic industries for wafer component electrode protection
Specifications
| Items | Unit | Specification | Test Method |
| Color | green | Visual | |
| Substrate thickness | mm | 0.038 | ASTM D-3652 |
| Total thickness | mm | 0.05 | ASTM D-3652 |
| Steel plate peeling force | g/25mm | 500-800 | ASTM D-3330 |
| Tensile strength | MPa | ≥130 | ASTM D-3759 |
| Elongation at break | % | ≥55 | ASTM D-3759 |
| Temperature resistance | °C/30min | 150 | |
| Voltage resistance | KV | ≥2 | |
| Length | m | 33-500 | |
| Inner diameter of core | mm | 76-78 |
